Our SiC-coated graphite susceptors for use in silicon epitaxy are particularly impressive due to their highest purity as well as homogeneous coating and excellent lifetime. They also feature high chemical and thermal resistance.
- Quality and experience
As a vertically integrated supplier, we control each step of the process from raw material to the final product to ensure consistent quality and a superior product.
- Rapid prototyping
SGL Carbon has invested in a dedicated rapid protype manufacturing center for a quick turn-around of R&D parts. This allows our customers faster validation of new susceptor designs and introduce new product designs to the market.
- Tailor made materials
SIGRAFINE 6510 and SIGRAFINE 6810 iso-graphite grades are the most well established and qualified grades for ASM susceptors and rings.
- Advanced coatings
Although our standard SIGRAFINE SiC coating is best in class, we are developing several proprietary coating technologies for pinhole resistance and higher lifetime to further improve cost of ownership.
- Tighter specification
SGL Carbon has proprietary technology to meet tight specifications for pocket profile, flatness, surface finish and purity. Our advanced inspection capabilities ensure that these specifications are met.
- Modeling capabilities
We have advanced modeling capabilities to achieve the tightest tolerances and epi layer uniformity.
- Technical support
SGL Carbon has an experienced, dedicated technical team that works with customers to address specific challenges to optimize performance.
A wafer needs to pass through several steps before it is ready for use in electronic devices. One important process is silicon epitaxy, in which the wafers are carried on graphite susceptors. The properties and quality of the susceptors have a decisive influence on the quality of the epitaxial layer of the wafer.
Epitaxy is used to improve the electrical characteristics of the wafer surface in a precisely controlled manner. Silicon epitaxy wafer is the foundation of all advanced logic devices, power electronics and Micro-Electro-Mechanical-Systems (MEMS) chips. The market for these applications is forecasted to be on a steady growth curve due to increasing functionalities of logic chips image sensors and power electronics for automotive applications.