The development of efficient methods and processes e.g. for heat dissipation and possibly cooling of electronic components like semiconductors, circuit boards, or systems is a permanent topic. Due to the continuous minimization of electronic parts the electrical energy is concentrated on smaller areas or volumes and therefore the requirements for even more effective thermal management increase.
This is where smart solutions for heat sinks and heat spreaders selected from the broad portfolio of SGL Carbon’s SIGRATHERM graphite materials for thermal management come into play. SIGRATHERM graphite foil can e.g. replace conventional heat-conducting pastes as an interface material. The excellent compressibility of flexible graphite foil produced from expanded natural graphite enables an optimized form fit and eliminates air inclusions.
Matched to your specific requirements, we identify the best solution from our broad range of materials for thermal management.
in electronic devices
|High end heat|
|Expanded graphite powder/|
|Cold/heat dissipation and storage||●||●||●|
|Heat dissipation in automotive||●||●||●|
|Heat dissipation in electronic devices||●|
|Heat dissipation in batteries||●|
Brochures, technical data and information sheets on our products for high-temperature and thermal management applications can be found in our SIGRATHERM Download Center.